Hao Qiu associate professor haoqiu@nju.edu.cn IC based on two-dimensional semiconductor		Dongxu Fan Ph.D Student DZ1923003@smail.nju.edu.cn IC based on two-dimensional semiconductor
Yun Mao Ph.D Student maoyun98@163.com Modeling and integrated circuit design based on TMDC devices		Fei Lu Ph.D Student 1004846936@qq.com IC based on two-dimensional semiconductor

Utilizing the characteristics of two-dimensional semiconductor materials such as high mobility, low power consumption, and high sensitivity to achieve high-performance, low-power, and multifunctional large-scale circuits (LSI). It can overcome many challenges faced by traditional silicon based integrated circuits at the micro and nano scales, and improve the reliability and stability of integrated circuits.

First, construct the EDA toolkit according to the standardized steps to conduct integrated circuit design, and then manufacture large-scale integrated circuits through microelectronic process flow. Most importantly, the two-dimensional semiconductor manufacturing process allows us to attempt to subvert traditional chip construction, such as the design and manufacturing of single chip three-dimensional stacked circuits.